- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
Patent holdings for IPC class B23K 35/26
Total number of patents in this class: 1348
10-year publication summary
|
98
|
132
|
131
|
124
|
111
|
134
|
106
|
101
|
79
|
29
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 654 |
274 |
| Murata Manufacturing Co., Ltd. | 22355 |
45 |
| Koki Company Limited | 69 |
42 |
| Alpha Assembly Solutions Inc. | 189 |
33 |
| Indium Corporation | 76 |
33 |
| Tamura Corporation | 350 |
30 |
| Harima Chemicals, Inc. | 202 |
29 |
| Nihon Superior Co., Ltd. | 77 |
29 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
28 |
| Mitsubishi Materials Corporation | 2378 |
27 |
| Fuji Electric Co., Ltd. | 4750 |
25 |
| Panasonic Corporation | 20786 |
19 |
| Sekisui Chemical Co., Ltd. | 3159 |
19 |
| Heraeus Deutschland GmbH & Co. KG | 643 |
14 |
| Metallo Belgium | 53 |
13 |
| Central Glass Company, Limited | 1244 |
12 |
| Nippon Micrometal Corporation | 126 |
11 |
| Hitachi Chemical Company, Ltd. | 2455 |
10 |
| Denso Corporation | 23338 |
10 |
| Infineon Technologies AG | 8189 |
10 |
| Other owners | 635 |